Description
In the modern era, electronic devices require more power than ever. Traditional board-level interconnects often require sacrificing board space to accommodate higher amperage or increasing the thickness of copper traces on the PCB or backplane. Alternatively, some solutions involve adding more wires to the incoming power cable. Amphenol’s RADSOK® PowerBlok™ offers a straightforward solution to deliver increased power to the board.
Features & Benefits
High Power to Board in a Small Footprint
Compact, 0.618 x 0.618 inch Rectangle
3.0mm PowerBlok™ carries 30A.
Backplane Power Interface with Compliant Pins for Signals
TouchProof Cover
Eliminates Threaded Fasteners
No Special Crimp Tools Needed
Application Specifics Pins
Radial Socket Design Ensure Multiple Points of Contact
Silver Plated Electrical Engagement Area Standard
Specifications
Electrical
Current Rating
35A to more than 200A
Number of contacts
1
Touch proof
Yes
Mechanical
Cable O.D.
2.4, 3.0, 3.6, 5.7, 6.0, etc.
Mating cycles
100+
Wire size (mm²)
2.4, 3.0, 3.6, 5.7, 6.0, etc.
Locking element
Quick Push-Pull
Material
Contact plating
Gold and Silver
Contacts
Copper
Shell
Metal
Environmental
Temperature range
-40~85℃
Flammability
UL94-V0
RoHS
Yes
REACH
Yes
Connectors to fit your industry requirements by design
Connect with Our Team
Amphenol Industrial's product lines consist of rectangular, standard miniature, fiber optic, EMI/EMP filter, and a variety of special application connectors.
Online Quote
Support