AIPG has industry leading experience engineering high current and high density interconnect solutions. Our RADSOK technology and our proven engineering experience for harsh environments enable Amphenol Industrial Operations to develop optimal solutions for server power interconnect needs.

Power to Board
High speed and high density electronics have driven demand for significant increases in the amount of power needed for power to board applications. To meet the need for higher current density interconnect Amphenol Industrial Operations developed the RADSOK® Power to Board series of connectors. RADSOK® Power to Board solutions facilitate the distribution of power with higher amperage, while allowing the design engineer to achieve size and weight reductions.
Conventional interconnects are limited in their ability to deliver high current with out consuming excessive board surface area. The RADSOK® Power to Board series of connectors incorporates a hyperbolic lamella socket contact construction that provides more contact surface area. The high performance contact enables higher current carrying capabilities with lower temperature rises than traditional contact systems.
Amphenol RADSOK® Power to Board product line offers many options for delivering high current, single-point connections to the PCB. Please contact your Amphenol Industrial representative for product extensions and custom applications.
Connectors to fit your industry requirements by design

Amphe-HST

Amphe-Lite™

PT Series

GT Reverse Bayonet

ACA-B Series

AC Threaded

97 E Pre-Earth FMLB

LPT Series

GTC Matrix Connectors

GTC-E Series

GT Quadrax

CMB

APC Series

Amphe-TVS Connector

Amphe-PRB

Amphe-OBTS Power Connector

Amphe-BTS

Amphe-RXS Connector Series

Amphe-PD™ Mini and Gen2

Amphe-PD™

Amphe-Lite Quadrax

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Amphenol Industrial's product lines consist of rectangular, standard miniature, fiber optic, EMI/EMP filter, and a variety of special application connectors.