Description
Amphenol’s RADSOK® enabled SMT RADSERT™ offers a versatile interconnect solution for high current and high power board-to-board mezzanine applications. It serves as an ideal choice for delivering power from mezzanine cards or suspended busbars above the board. The SMT RADSERT™ is highly adaptable and can accommodate custom board stack heights.
These interconnects are characterized by their low-profile design, single-point, high-current contacts that can be applied to a PCB or busbar. Additionally, they are available with “Super Twist” technology, which enhances lead-in and radial misalignment tolerance, making them suitable for multiple mating positions or blind mate applications. RADSERT™ termination options include SMT, knurl “Press-fit,” or wave solder, with a remarkable current-carrying capability of up to 200A.
Features & Benefits
The SMT RADSERT™ is preferred for PCB applications for efficient current transmission and ease of application
High power to board interconnect in a small package
Perfect for mezzanine applications
RADSOK® R4 hyperbolic socket design ensures many points of contact
The SMT RADSERT™ is compatible with standard surface mount board fabrication processes
RADSERT™ 2.4mm (35A), 3.0mm (60A), 3.6mm (70A), 5.7mm (120A) & 8.0mm (200A)
No special crimp tools required
No threaded fasteners
Faster through-put
Specifications
Electrical
Current Rating
Up to 200A
Number of contacts
1
Mechanical
Cable O.D.
2.4, 3.0, 3.6, 5.7 and 8.0
Mating cycles
100+
Wire size (mm²)
2.4, 3.0, 3.6, 5.7 and 8.0
Locking element
Quick Push-Pull
Material
Contact plating
Silver
Contacts
Copper
Shell
Metal
Environmental
Temperature range
-40 to 125C
Flammability
UL94-V0
RoHS
Yes
REACH
Yes
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Amphenol Industrial's product lines consist of rectangular, standard miniature, fiber optic, EMI/EMP filter, and a variety of special application connectors.
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