RADSOK® RadStack™ | PCB Mezzanine Power Connector Drives Success

PCB Mezzanine Power Connector for Board-Level Power Applications

The RADSOK® RadStack™ from Amphenol Industrial Operations is a next-generation PCB mezzanine power connector engineered to meet the increasing demands of compact power delivery. Developed using Amphenol’s proven RADSOK® contact technology, RadStack™ enables superior current handling in limited space—making it ideal for power electronics that require board-to-board or mezzanine-level interconnects with minimal thermal loss and high electrical efficiency.

RADSOK® RadStack™ is designed for use in applications where traditional wire-based interconnects are not viable due to space constraints or the need for increased durability and scalability. This PCB mezzanine power connector offers engineers a reliable, modular solution that simplifies system architecture, reduces component count, and supports flexible mechanical alignment during installation.

Stackable Design for Scalable Power Delivery

The RADSOK® RadStack™ series features a vertically stackable configuration that allows multiple contacts to be arranged in parallel for increased current capacity. This modularity is especially beneficial for mezzanine board layouts, where vertical space is used efficiently to support multi-level circuit board configurations. Each RadStack™ connector is available in multiple height options to accommodate various board spacing requirements without sacrificing electrical performance.

This connector series supports up to 200 A of continuous current and is optimized for low contact resistance, minimizing power loss and improving thermal efficiency. Whether used as a single contact or in a stacked array, RADSOK® RadStack™ ensures consistent performance across a wide range of power levels.

Engineered for Thermal and Mechanical Reliability

RADSOK® RadStack™ is built around Amphenol’s patented RADSOK® contact system, which leverages a hyperbolic grid design to increase contact surface area. This design lowers temperature rise and voltage drop while providing high mating cycle durability. It’s rated for up to 500 mating cycles, making it ideal for systems that require frequent maintenance or modular upgrades.

The connector’s compact footprint enables dense packaging on the PCB, while the robust mechanical structure provides excellent resistance to vibration and shock—essential for mission-critical environments like industrial automation, energy storage, datacom, and power conversion systems.

Designed for Mezzanine-Level Integration

Unlike conventional board connectors, RADSOK® RadStack™ is optimized for mezzanine-style PCB interconnects, where multiple circuit boards are stacked vertically within a single enclosure. These configurations are commonly found in server power supplies, AI computing platforms, battery management systems, and high-speed power electronics.

RADSOK® RadStack™’s vertical design helps engineers save horizontal space and simplify thermal management strategies by aligning heat-generating components in efficient airflow paths. It also reduces the need for intermediate components like busbars or cables, leading to cleaner layouts and lower system cost.

Application Versatility

RADSOK® RadStack™ PCB mezzanine power connectors are suitable for a wide range of applications, including:

• Mezzanine board-to-board power distribution
• High-performance computing and AI systems
• Industrial automation and motor drives
• Battery storage systems and inverters
• Modular power conversion platforms

Each unit is configurable to meet custom requirements in terms of stack height, number of contacts, and current ratings, providing design flexibility across industries and power levels.

Streamline System Design with RadStack™

With its innovative stackable architecture and proven RADSOK® technology, the RADSOK® RadStack™ connector platform helps OEMs and system designers reduce complexity, improve thermal performance, and achieve higher power capability in PCB mezzanine power connector applications. This makes it a future-ready solution for power delivery challenges in next-generation electronic systems.

Contact us today to learn how the RADSOK® RadStack™ can elevate your mezzanine power architecture or download the datasheet for detailed configurations and performance metrics.